基于非线性模型提升覆晶薄膜封装显示模组拆解良率的研究

Research on Improving the Disassembly Yield of COF Package Display Module based on Nonlinear Model

目的:随着全面屏逐渐占领手机市场,卷带式覆晶薄膜封装工艺(COF)越来越多地应用在薄膜晶体管液晶显示器(TFT-LCD)显示模组中。COF工艺相比传统的玻璃基板工艺(COG),面板的氧化铟锡(ITO)端子更窄,返修过程中更容易破损,拆解成功率明显下降,拆解成本随之升高,因此亟需提升拆解良率。方法:为实现目标,首先利用流程图分析影响拆解良率的关键步骤,然后通过鱼骨图、因果矩阵、柏拉图、假设检验等方法确定影响拆解良率的显著因子,最后通过实验设计(DOE)进一步揭示显著因子对拆解良率的影响,建立非线性数学模型,找到最佳拆解方案。结果:批量验证后,将最优参数组合导入在产项目,并将其固化至标准化文件中。最终拆解良率从75.23%提升至93.28%,大幅降低了拆解损失。结论:本研究结合破损现象分析拆解缺陷的主要类型,并通过降低端子缺陷率、玻璃基板相关缺陷率、电性缺陷率,达到了提升整体拆解良率的效果。

Objetive:As full screens gradually occupy the mobile phone market,more and more COF packaging processes are used in TFT-LCD display modules.Compared with the traditional COG process,the Panel ITO terminals are narrower,and are more likely to be damaged during the repair process.The success rate of disassembly is greatly reduced,the cost of disassembly is increased,and the yield of disassembly is urgently needed.Method:In order to achieve the goal,this research first uses the flow chart to analyze the key steps that affect the disassembly yield,then determines the significant factors that affect the disassembly yield through fishbone diagrams,effect matrices,Pareto diagrams,hypothesis testing,etc.Finally,it reveals the significant factors through DOE to influence the yield of dismantling,and establish a non-linear mathematical model to find the best dismantling plan.Result:After batch verification,the optimal parameter combinations are imported into the production project and solidified into the standardized files.The final disassembly yield increased from 75.23%to 93.28%,which greatly reduces the disassembly loss.Conclusion:The research analyzes the main types of disassembly defects based on the damage phenomenon,and achieves the effect of improving the overall disassembly yield rate by reducing the terminal defect rate,panel defect rate,and electrical defect rate.