内嵌氮化铝(AIN)陶瓷绝缘散热模块的PCB板的制作工艺探讨

Discussion on fabricating of AIN ceramic coin embedded into FR-4

文章选用一种DPC型氮化铝(AIN)陶瓷绝缘散热材料,对该种材料制作的嵌氮化铝(AIN)陶瓷块的PCB板加工工艺进行相关的研究,重点研究了不同的芯板和PP开窗尺寸对嵌氮化铝(AIN)陶瓷块PCB板压合工艺的影响.

The aim of this paper is to study on fabricating processes of the DPC—based AIN ceramic,an insulation heat—sink material that is embedded into PCB.Great attention is paid to the effects of different cores and PP window opening size on the laminating process of AIN ceramic embedded PCB.