摘要
研究人员往往通过改变热沉材料、改进封装结构和散热结构等方式来解决大功率LED的散热问题。本文采用简化的等效封装模型,对几种基板材料的等效热阻进行计算,用计算结果来进行比较,从而选择出更为合适的可用于封装大功率LED的基板材料。
Usually,the heat of large power LED is eliminated by changing heat sink materials,improving packaging and heat dissipation structures.In the paper,the simplified equivalent model is established to calculate the equivalent thermal resistance of several board materials,and by comparing the calculation results,the even more suitable packaging board material is found out.
出处
《装备制造技术》
2006年第4期81-84,共4页
Equipment Manufacturing Technology
基金
重庆市科委资助项目
(CST2005AB4016)
关键词
大功率LED
基板材料
简化等效模型
散热
Large power LED
Board material
Simplified equivalent model
Heat dissipation
