摘要
从基板、布线、框架、层间介质和密封5个方面对电子封装材料及其性能进行了全面系统的介绍,在电子封装材料的众多领域,金属封装和陶瓷封装被塑料封装所取代。并对近年来电子封装技术的研究发展情况进行了简要介绍。
In this paper, the property and materials of electronic packaging are introduced comprehensively and systematically. In the most field of electronic packaging, the metal and ceramics packaging materials are substituted by plastic packaging materials gradually. The progress of the technology of electronic packaging in recent years is briefly described.
出处
《粉末冶金材料科学与工程》
EI
2003年第3期216-223,共8页
Materials Science and Engineering of Powder Metallurgy
关键词
电子封装材料
基板
性能
发展状况
electronic packaging material
substrate
performance
development actuality
