摘要
从发展航空航天、微电子、汽车及电器等高技术领域先进材料的角度 ,阐述了可熔体加工热塑性聚酰亚胺的发展现状和最新进展 ;报告了热塑性聚酰亚胺的挤出成型、注射成型、纺丝、涂覆等工艺 ;讨论了热塑性聚酰亚胺的分子结构对聚酰亚胺热性能的影响 ;介绍了几种最新热塑性聚酰亚胺的特点和典型应用实例 ;指出开发新型热塑性聚酰亚胺应综合考虑可加工性、耐热性。
Development and the most resent research on melt processable thermoplastic polyimides (TPIs) are presented in view of the processing of advanced materials used in the field of aerospace, microelectronics, automobile and electrical equipments. Extrusion, injection, spinning and coating conditions of TPIs are reported. The effects of molecular structures on the thermal properties of polyimides are discussed as well. Several new TPIs and some examples of commercial TPIs are introduced in this paper; the melt processability, thermal resistibility, cost and source of stuff should be considered for new TPls development.
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2004年第3期5-11,共7页
Aerospace Materials & Technology