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用于MEMS器件的真空密封技术 被引量：1

Vacuum Sealing Technology for MEMS
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摘要 介绍MEMS器件中常用的键合技术和适用于真空密封与器件性能要求的特殊结构设计,以及提高和保持器件高真空环境的方法。合适的真空密封技术不仅能够保证和提高MEMS器件的性能,同时可以简化工艺步骤,降低器件成本。 Some bonding technologies, which were very often used for sealing vacuum chamber in MEMS sensors,are introduced. A special structure was designed in order to meet the requirements of vacuum packaging process and to promote and keep high vacuum atmosphere inside the chamber. A suitable vacuum sealing technology should not only ensure the performance of the devices, but also simplify processes and reduce the product cost.
作者 林仰魁 钱开友 徐东 蔡炳初
机构地区 上海交通大学微纳米科学技术研究院薄膜与微细技术教育部重点实验室微米纳米加工技术国家级重点实验室
出处 《微细加工技术》 2004年第4期64-68,78,共6页 Microfabrication Technology
基金 上海市科技发展基金资助项目(0214nm031)
关键词 MEMS 传感器 键合技术 真空密封 MEMS sensor bonding technology vacuum packaging
分类号 TB7 [一般工业技术—真空技术]
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参考文献15

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微细加工技术
2004年 第4期

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