摘要
介绍了采用金属Zn粒子悬浮液活化要镀镍的印制板(PCB)Cu电路表面,使其可以进行化学镀镍的工艺方法,它可以克服Pd-Sn活化的缺点.
The copper circuitry surfaces of printed circuit boards (PCB) which will be electrolessly nickel plated are activated by aqueous suspension of particulate zinc metal, and then the electroless nickel plating is carried out. By so doing the disadvantages in Pd-Sn activation are overcomed.
出处
《表面技术》
EI
CAS
CSCD
1994年第1期31-33,共3页
Surface Technology
关键词
印制板
活化剂
镀镍
化学镀
printed circuit board, activator, electroless nickel plating