摘要
综述了微弧氧化工艺自20世纪60年代产生至今在电源、电解液和基体合金方面的发展过程,总结了微弧氧化膜的化学成分及相结构从基体到膜表面的分布规律及电流密度、氧化时间、电压、电解液组分等因素对陶瓷膜生长和性能的影响规律。同时指出微弧氧化技术虽具有广泛的应用前景,但在理论研究和生产成本控制等方面仍存在不足之处。
A review was given on the development of micro-arc oxidation technology since its establishing in 1960s, with the power supply, electrolyte, and substrate metals to be focused on. The distribution rules of the compositions and phase structures of the micro-arc oxidation coatings, as well as the influences of current density, oxidation time, voltage, electrolytes, and other factors on the growth and properties of the coatings were summarized. It was pointed out that there still exist some disadvantages in the related theoretical research and production cost control of the micro-arc oxidation technology, though it has a promising application perspective.
出处
《材料保护》
CAS
CSCD
北大核心
2005年第6期36-40,共5页
Materials Protection
关键词
微孤氧化
陶瓷层
表面改性
micro-arc oxidation
ceramic coating
surface modification