摘要
以正二十烷、聚乙烯和乙丙橡胶等为原料经熔融挤出,制成正二十烷含量10%～65%的共混切粒.以正十八烷微胶囊和聚乙烯为原料经熔融挤出,制成微胶囊含量10%～60%的共混切粒.采用差示扫描量热仪和熔融指数仪测试了多种组成切粒的相变性能和流动性能.切粒的热焓随相变材料含量的增高而增大,含65%正二十烷的切粒的热焓为160 J/g左右,含有60 wt%微胶囊的切粒的热焓为70 J/g左右.切粒的熔融指数随相变材料或相变材料微胶囊添加量的增高呈现指数增大或反S曲线的形式.
The blended chips containing 10%~65% of n-Eicosane were fabricated with n-Eicosane, polyethylene (PE) and ethylene-propylene copolymer. The blended chips containing 10%~60% of microencapsulated n-octadecane (MicroPCM) were fabricated with MicroPCM and polyethylene. Phase change properties and fluidities of these chips were investigated with DSC and melting index tester. The enthalpies of these chips rise with the increase of the PCM or MicroPCM contents. The enthalpy of the chip containing 65% of n-Eicosane is approximately 160 J/g. and the enthalpy of the chip containing 60% of microencapsulated n-Octadecane is approximately 70 J/g. The MI of the chip containing n-Eicosane rises in exponent with the increase of the PCM content. And the relationship between the MI of the chip containing microencapsulated n-Octadecane and the content of MicroPCM is a reversed S curve.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2005年第4期149-152,共4页
Polymer Materials Science & Engineering
基金
国家自然科学基金资助项目(50073015)
