摘要
芯片集成度的提高和大面积化，封装多针脚、细引线、小型化等会引起器件可靠性的下降。本文依据强度理论和试验，预测塑料封装中的损伤模型并提出了减少损伤，增加可靠性的措施。
The rapid increase in the integrated degree and dimension of chips,the more I/O pins number, fine line pitch and miniaturization in package would result in the degradation of reliability of electronic devices. The paper explaines the model of damage in IC plastic package and puts forward proposals to reduce IC package damage.
出处
《半导体情报》
1995年第3期40-46,共7页
Semiconductor Information
关键词
封装
塑料
电子元件
集成电路
Package,Plastic,Oxidation, Stress, Soler joint,Fatigue
