镍磷合金镀液稳定性的探讨

A Discussion on Stability of Ni-P Alloy Plating Solution

在电镀过程中，含亚磷酸的镍磷合金镀液的ｐＨ值和Ｎｉ２＋离子浓度随电镀时间的延长而增大。本文分析其原因，并提出采用不溶性阳极与可溶性阳极配合或交替地使用，可使镀液ｐＨ和Ｎｉ２＋离子浓度稳定。

During nickel-phosphorus alloy plating in a solution containing phosphorous acid, PH value and Ni2+ ion concentration will increase with the increase of the plating time. The cause of such increases is described. By using soluble and insoluble anodes co-operatively or alternatively, constant value of pH and Ni2+ ion concentration may be maintained.