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MEMS技术的研究现状和新进展 被引量：11

Research status and new development of MEMS technology
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摘要 介绍MEMS技术几个主要方面的研究现状和最新进展:MEMS的加工技术、封装技术、检测技术。阐述MEMS技术仍面临的问题。 The research status and new development,including MEMS mieromaehining technology, packaging technology and testing technology is introduced emphatically. The problems of MEMS are set forth.
作者 张帅 贾育秦
机构地区 太原科技大学
出处 《现代制造工程》 CSCD 2005年第9期109-112,共4页 Modern Manufacturing Engineering
关键词 MEMS MEMS加工技术 MEMS封装技术 MEMS检测技术 MEMS MEMS micromachining technology MEMS packaging technology MEMS testing technology
分类号 TP271.4 [自动化与计算机技术—检测技术与自动化装置]
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参考文献5

二级参考文献18

  • 1[1]COHN M B, ROEHNELT R, XU J H, et al. MEMS packaging on a budget (fiscal and thermal) Electronics, Circuits and Systems [A] . 2002. 9th International Conference on, Volume:1, 15-18 Sept. 2002, vol. 1: 287-290.
  • 2[2]PERSSON K, BOUSTEDT K. Fundamental requirements on MEMS packaging and reliability [ A] . Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium [C] . 2002: 1-7.
  • 3[3]O'NEAL C B, MALSHE A P, SINGH S B, et al. Challenges in the packaging of MEMS [A] . Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings.International Symposium [C] . 1999: 41-47.
  • 4[4]http: //tds.ic.polyu.edu.hk/mtu/atm/index.htm.
  • 5[5]http: //www.smtinline.com/chinese/wafer-ch.htm.
  • 6[6]MIRZA A R. Wafer-level packaging technology for MEMS[A]. Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference [C] . 2000. 1: 23-26.
  • 7[7]MALUF N. An introduction to microelectromechanical systems engineering [M] . M. Boston: Artech House, 2000, 223-235.
  • 8[8]RAMERSHAM R, GHAFFARIAN R. Challenges in interconnection and packaging of microelectromechanical systems (MEMS) [A] . Electronic Components and Technology Conference, 2000. 2000 Proceedings. 50th [C], 2000. 666-675.
  • 9[9]BUTLER J T, BRIGHT V M, COMTOIS J H. Advanced multichip module packaging of microelectromechanical systems[A]. Solid State Sensors and Actuators, 1997. TRANSDUCERS'97 Chicago, 1997 International Conference [C] . 1997,1: 261-264.
  • 10[10]BOUSTEDT K, PERSSON K, STRANNEBY D. Flip chip as an enabler for MEMS packaging [A] . Electronic Components and Technology Conference, 2002. Proceedings. 52nd [C] .2002: 124-128.

共引文献32

同被引文献68

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二级引证文献17

现代制造工程
2005年 第9期

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