摘要
在再流焊无铅化过程中,再流焊的有铅要素与无铅要素的兼容性直接影响产品质量。本文对有铅再流焊炉与SAC无铅焊膏和OSP、ENIG无铅焊盘镀层的兼容性进行了初步试验,证明三者有较好兼容性。
In the course of the lead free reflow soldering, lead and Lead free of reflow soldering affect the quality of product. Make experiment aiming at the compatibility of lead reflow soldering and SAC lead free paste, OSP, ENIG lead free PCB pad plating. The results show that they have good compatibility.
出处
《电子工艺技术》
2006年第1期14-18,共5页
Electronics Process Technology
关键词
再流焊
无铅化
兼容性
Reflow soldering
Lead free
Compatibility
