塑封器件失效机理及其快速评估技术研究

Study of Failure Mechanism and Evaluation Method for Plastic Encapsulated Microelectronics Devices

针对影响塑封器件可靠性的五种失效机理,即腐蚀失效、爆米花效应、低温/温冲失效、闩锁以及工艺缺陷等方面进行分析和讨论,并提出利用高温潮热和温度冲击试验对塑封器件的可靠性进行评估。还介绍了美国航天局Goddard空间飞行中心提出的对塑封器件进行高可靠性筛选的方案。

Five FM modes which were the failures of erode, heat expansion, low temperature/temperature shock, latch and technical defect were discussed. Based on this, high accelerate stress test （HAST） were done to evaluate the reliability of PEM devices, the proposal from Goddard center of NASA which screen the high reliability PEM devices were introduced.