摘要
介绍了目前常用于电子元器件电镀纯锡液的主要技术要求。阐述了酸性硫酸盐镀锡、酸性氟硼酸盐镀锡或锡-铅合金、烷基磺酸盐镀锡或锡-铅合金、中性或弱酸性镀锡或锡-铅合金的工艺特点、镀液镀层性能及性价比。还介绍了Sn-B、iSn-A g、Sn-Cu无氟无铅可焊性电镀锡基二元合金的特点、性能及典型的工艺配方。
Main technical requirements of pure tin plating bath common used for electronic component and device electroplating were introduced. Technological characteristics, properties of plating bath and coating, ratio between performance and price for tin or tin alloy electroplating with acidic sulfate bath, acidic fluoborate bath, alkylsulfonatebath, neutral or weak acidic baths were elecidated. Characteristics, performance and typical technological formulaes of fluorine-free and lead-free tin base binary alloy, such as Sn-Bi, Sn-Ag and Sn-Cu, solderable coatings electroplating were introduced as well.
出处
《电镀与精饰》
CAS
2006年第5期33-38,共6页
Plating & Finishing
关键词
锡
锡合金
可焊性镀层
电镀
tin
tin alloy
solderable coating
electroplating
