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高热流密度电子设备散热技术 被引量:21

Cooling Technique for High Flux Electronic
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摘要 高发热密度电子设备对散热提出了更高的要求,本文就平板热管、微通道、液体喷淋冷却等典型的高性能散热技术及其应用情况进行了讨论和综合分析。 Power dissipation of high flux electronics become critical , and high performance cooling techniques are required urgently. Some promising cooling techniques and their practical application were discussed, such as flat plate Heat pipe, micro channel and liquid spray cooling.
出处 《流体机械》 CSCD 北大核心 2006年第9期71-74,共4页 Fluid Machinery
关键词 高热流密度 电子散热 液体冷却 毛细作用 high flux electronics cooling liquid cooling capillary
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参考文献6

  • 1Intermnational SEMATECH,international Technology Roadmap for Semiconductors,2003.
  • 2Tuckerman D B,Pease R F W.High performance heat sink for VISI[J].IEEE Electron Device Letters.1981,2 (4):126-129.
  • 3Arel Weisberg,Haim H B.Analysis of microchannels for integrated cooling[J].Int.J.Heat Mass Transfer,1992,35 (10):2465-2474.
  • 4李腾,刘静.芯片冷却技术的最新研究进展及其评价[J].制冷学报,2004,25(3):22-32. 被引量:66
  • 5Martin Cerza.Navy Cooling Needs and Future Technologies for Next Generation Naval Systems[M].United States Naval Academy.2004.11.
  • 6Azar K.Advanced cooling concepts and their challenges,Invited talk at Eight International Workshop on Thermal Investigations of Ics and Systems(THERMINIC),Madrid,Octomber,2002.

二级参考文献56

  • 1[39]Glezer A, Amitay M. Synthetic jets. Annual Review of Fluid Mechanics, 2002, 34: 503-529
  • 2[40]http://widget.ecn.purdue.edu/~CTRC/research/projects/Ultrasonic%20piezoelectric/
  • 3[41]Heffington SN, Black WZ, Glezer A. Vibration-induced droplet atomization heat transfer cell for high-heat flux applications. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2002, 408-412
  • 4[43]Chen G, Dresselhaus MS, Dresselhaus G, et al. Recent developments in thermoelectric materials. International Materials Reviews, 2003, 48: 45-66
  • 5[44]Caillat T, Fluerial JP, Snyder GJ. Thermoelectric properties of the incommensurate layered semiconductor GexNbTe2. Journal of Materials Research, 2000, 15: 2789-2793
  • 6[45]El-Genk MS, Saber HH. High efficiency segmented thermoelectric unicouple for operation between 973 and 300 K. Energy Conversion and Management, 2003, 44: 1069-1088
  • 7[46]Jeffrey SG, Tristan SU. Thermoelectric efficiency and compatibility. Phys. Rev. Lett., 2003, 91: 148301
  • 8[47]Miner A, Majumdar A, Ghoshal U. Thermo-electro-mechanical refrigeration using transient thermoelectric effects. Appl. Phys. Lett., 1999, 75: 1176-1178
  • 9[48]Landecker K. J. Phy. C: Solid St. Phys., Improvement of the performance of Peltier junctions for thermoelectric cooling, 1970, 3: 2146-2150
  • 10[49]Straehle JW, Rath S, Hans T, et al. Prospects for Peltier cooling of the cuprate superconductors. 17th International Conference on Therrnoelectrics, 1998, 491-494

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