摘要
随着当今电子产品朝着更小,更轻方向发展,各种平板显示器得到了广泛的应用,LCD面板就是其中的典型代表。COF技术凭借自身的许多优点,成为了LCD驱动IC的主要封装形式。本文就COF的结构,特点,所用材料,关键工艺,应用状况及其发展趋势进行了综述。
The trend that electronic products become more diminutive and more lightsized continues. So, various flat panel display are applied widely, the LCD panel is a prominent type. the ODF technology has become the primary packaging technique for driver IC of LCD by many advantages owned by it. In this paper, the structure, features, key process, applications and developing direction of COF are summarized.
出处
《世界科技研究与发展》
CSCD
2006年第6期27-32,共6页
World Sci-Tech R&D
