摘要
通过透射电镜(TEM)、扫描电镜(SEM)、能谱分析(EDS)对Si、Al、K掺杂烧结钼条和退火钼丝的组织形貌进行了跟踪检测分析;通过DSC和硬度试验检测Si、Al、K掺杂钼丝的再结晶温度;通过热模拟试验对纯钼条和Si、Al、K掺杂钼条的高温综合力学性能进行了对比分析。结果表明:Si、Al、K掺杂使钼条的高温综合力学性能得到了明显的改善;在本试验条件下,Si、Al、K掺杂使钼丝的再结晶温度提高约550~600℃,再结晶后由长径比大的晶粒形成燕尾搭接状链锁结构组织;Si、Al、K掺杂钼丝的强化相是K泡和硅酸铝钾颗粒。
Microstructure and properties of the molybdenum wire doped with Si ,Al,K were studied by use of TEM, SEM, EDS, DSC and Thermal Simulation etc in this paper. The results show that the high temperature mechanical properties of molybdenum wire have been improved markedly by Si,AI,K doping; the recrystallization temperature of molybdenum wire has been increased by 550- 600℃ via Si ,Al,K doping which generates an interlocked grain structure; the strengthening phase of Si、 Al、K doped molybdenum wire is not only the K bubble, but also the potassium aluminosilicate dopant particles.
出处
《粉末冶金技术》
EI
CAS
CSCD
北大核心
2007年第1期7-12,16,共7页
Powder Metallurgy Technology
关键词
SI
AL
K掺杂
钼丝
再结晶温度
K泡
高温力学性能
Si、 Al、 K-doping
molybdenum wire
recrystallization temperature
K bubble
high temperature mechanical property