热膨胀系数不匹配导致的塑封器件失效

The Failure of PEM Caused by the Mismatch of CTE

塑封器件使用过程中由于塑封材料和芯片之间热膨胀系数的不匹配,导致在外界温度变化时的应力释放对芯片造成损伤。文中通过VLSI失效分析,对这种应力造成的芯片损伤进行了研究,并提出利用环境应力试验和可靠性分析的方法暴露热膨胀系数不匹配导致芯片损伤的技术。

The paper discusses the damage of plastic encapsulated microelectronic （PEM） devices during soaked temperature changed environment. The failure mechanism is the mismatch of coefficient of thermal expansion （CTE） between the plastic encapsulated and the chip. The failure mechanism of PEM should be exposed according to high accelerate stress test （HAST）.