摘要
主要通过灌封工艺技术在某高压电源组件“三防”的应用与研究,从灌封工艺路线的设计、灌封材料的优选、关键工序的控制等几个方面分别进行了详尽的分析;并结合多批次实际生产的检验与研究,证明此灌封工艺完全满足产品的设计要求。
Discuss the design of embedding technology route, the selection of embedding material and the control of the key operating sequence by analyzing and studying the embedding technology for some HV power supply assembly. And with the test and research of several Catches of manufacturing status, the embedding technology is proved to satisfy the design requirement.
出处
《电子工艺技术》
2007年第3期174-175,178,共3页
Electronics Process Technology
关键词
灌封工艺
导热填料
硅橡胶
Embedding technology
Heat conduction stuffing
Silicon rubber
