摘要
本文介绍了纯铜试样拉伸过程中晶界发射位错的透射电子显微镜动态观察结果。表明面心立方多晶纯铜晶界中也存在“坎”,在应力的作用下,“坎”向晶粒内部发送位错。
The in situ observations of emitting dislocations from grain boundaries by a transmission electron microscopy for pure copper during elongation have been performed, It is shown that there also exists 'ledge' at the grain boundaries in f. c. c. pure copper, under action of stress, which is able to emit dislocation into grain.
出处
《上海钢研》
1997年第1期12-14,共3页
Journal of Shanghai Iron and Steel Research
关键词
透射电子显微镜
铜
位错
晶界
transmission electron microscope copper dislocation grain boundary