期刊文献+

无铅焊料的盐雾腐蚀性能研究 被引量:3

Investigation on corrosion performance of lead-free solders
下载PDF
导出
摘要 无铅焊料已经进入实用化研究阶段,Sn-3Ag-0.5Cu及sn-8Zn-3Bi等几种典型合金在-些电子产品中已经得到实际应用。然而对于上述无铅焊料的腐蚀性却报道较少。选取Sn-3Ag-0.5Cu、Sn-8Zn-3Bi及Sn-8Zn-3Bi—Nd合金进行盐雾腐蚀实验,对腐蚀表面进行宏观及微观分析,并与传统的sn—Pb焊料对比,考察焊料合金的耐腐蚀性能。结果表明:Sn-3Ag-0.5Cu具有比传统Sn—Pb焊料更优越的耐腐蚀性能;Sn-8Zn。3Bi合金由于组织中存在更为粗大的初生Zn相易于优先腐蚀而导致抗盐雾腐蚀性能不良,因此在腐蚀开始阶段腐蚀速率相对Sn-8Zn-3Bi—Nd合金更快,但后者初生相数量更多,因此在更长时间腐蚀后腐蚀量更大。 With development research, some typical solders, such as Sn-3Ag-0.5Cu and Sn-8Zn-3Bi, have been used in some electronic products. But there are few reports about the corrosion property of those lead-free solders. The salt spray corrosion properties of Sn-3Ag-0.5Cu, Sn-8Zn-3Bi and Sn-8Zn-3Bi-Nd alloys were tested in this study, and the corrosion surface were observed and analyzed. Those alloys were compared with the traditional Sn-Pb solder. The experiment results show that Sn-3Ag-0.5Cu has better corrosion resistance than that of Sn-Pb alloy. Comparing with Sn-8Zn-3Bi-Nd, larger primary Zn phase in Sn-8Zn-3Bi resulted in bad performance of corrosion resistance in the beginning corrosion stage. The primary Zn phase in Sn-8Zn-3Bi-Nd showed littler size than that of Sn-8Zn-3Bi, but the quantity of the primary Zn was larger, so the sum of corrosion at the former is larger after long period of corrosion
出处 《功能材料》 EI CAS CSCD 北大核心 2007年第A08期3267-3270,共4页 Journal of Functional Materials
关键词 无铅焊料 Sn-Zn焊料 Sn-3Ag-0.5Cu 腐蚀 leader.free solder: Sn - Zn alloy: Sn-3Ag-0.5Cu corrosion
  • 引文网络
  • 相关文献

参考文献10

二级参考文献43

共引文献115

同被引文献27

引证文献3

二级引证文献13

;
使用帮助 返回顶部