塑封双极型功率晶体管的失效与案例分析

Failure Analysis and Case Study of Plastic Capsulation Power Bipolar Transistor

由于其自身的结构与封装形式,塑封双极型功率管存在很多可靠性问题。介绍了塑封双极型功率晶体管可靠性问题及失效机理,包括封装缺陷、粘结失效以及由于温度变化而引起的热应力失效和由于吸入潮气而导致的腐蚀失效。通过剖析一晶体管的失效机理,给出了对此类晶体管失效分析的方法和思路。讨论了晶体管存在异物、芯片粘结失效和热应力失效等失效模式。

Plastic capsulation power bipolar transistor exists many reliability problems due to the structure and package style. The reliability problems and failure mechanism were summarized, including technology defects such as package defects, adhesion defects, thermal stress caused by temperature variation, and erosion by humidity intrusion. Some of failure mechanism cases were given to show the considerations and solutions for analyzing failures mechanism. The cases include foreign matter failure, chip adhesion failure and thermal stress failure, etc.