塑封微电子器件失效机理研究进展

Research of Failure Mechanism on Plastic Encapsulated Microelectronics Device

塑封器件在现在的封装产业中具有无可比拟的优势,相关研究引起了人们广泛关注。简要介绍了塑封微电子器件的发展史,以及国内外塑封器件可靠性的研究现状。对塑封器件的主要失效机理研究进展进行深入探讨,如腐蚀、分层、开裂等,提出了几种提高塑封器件可靠性的措施。论述了用于塑封器件质量评估的试验方法,并展望了塑封器件在军工领域的潜在应用前景。

Plastic encapsulated technique has unparalleled advantages in the packaging industry, and concerned researches attract great attention. The history and the research on reliability of dom_astic and abroad plastic encapsulated device are introduced. The research on the main failure mechanism is discussed, such as the corrosion, the lamination, the cracking. Several measures are proposed to enhance the reliability of the devices. The methods for evaluating the plastic encapsulated devices are elaborated, and the application in the army industry domain is forecast.