摘要
以PCB行业的市场发展趋势为出发点,研究了PCB用微钻技术的现状和发展趋势。论文重点描述了小尺寸微钻的开发及量产技术、微钻表面强化技术、超细微孔的钻孔机理的研究进展。
On the basic of PCB market trend, the status quo and development trends of PCB-drilling technology are discussed. Papers described the focus of small-size development drilling and production technology, micro-drilling technology to strengthen the surface, ultra-fine porous bored mechanism of progress.
出处
《印制电路信息》
2008年第8期34-37,69,共5页
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