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化学镀高磷Ni-P合金的研究 被引量:3

Study of High Phosphorous Electroless Ni-P Plating
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摘要 选取对溶液和镀层性能有较大影响的配位剂、促进剂及pH值等五因素,设计L16(45)正交试验法,研究其对镀层性能的交互作用,并优化验证工艺配方,优选一种低孔隙率的化学镀高磷Ni-P工艺。 Five factors, including complex agents, accelerating agents, pH value, etc., which have more influence on coating quality and solution were chosen in 1.16(4^2) orthogonal test designed for investigating their intereaction on coating properties. and the process and formula were optimized and verified. A process of electroless Ni P plating with high phosphorous and low porosity was screened out.
出处 《电镀与环保》 CAS CSCD 2008年第5期31-33,共3页 Electroplating & Pollution Control
基金 石油管力学和环境行为重点实验室开放基金
关键词 化学镀 高磷 配位剂 正交实验 electroless plating high content of phosphorous complex agcnts orthogonal test
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