固-固接触界面热传输研究

The investigation of solid-solid contact interface thermal transfer

提出了固-固接触热传导接触界面层的概念并进行了解释。接触界面层的建立,把微结构的散射和辐射热传导机制统一于界面层内,通过对接触界面层、接触界面层的厚度和界面层热导率等的讨论,初步揭示了接触界面层热传导的机制。在界面层微观传热的机制上,建立了接触界面层热阻预测模型,并把模型预测接触热阻值与扩散失陪模型(DMM)以及实验值进行了比较。结果显示该模型克服了DMM模型预测值偏低的缺陷,这些将对接触界面层的微尺度热分析有一定的帮助。

The concept of contact interface layer was explained. Based on the contact interface layer, the thickness and thermal conductivity of contact interface layer were discussed, and the diffusive and radiative thermal conduction were occurred in contact interface layer. The mechanism of micro - structure was shown up. The contact interface thermal resistance model（CITR） was set up, the calculated value of the CITR was compared with the value of DMM and experimental datum, the results show that the limitation of the DMM is hurdled. These are helpful of the micro - structure thermal transfer analysis.