Cu-W复合电沉积工艺和镀层电弧侵蚀性能研究

Study on Composite Electroplating Process of Cu-W and Arc Erosion Property of Composite Coating

在纯铜表面利用复合电沉积的方法形成Cu—W复合镀层，使其满足电触头材料使用性能。研究了镀液中W的质量浓度、阴极电流密度、搅拌强度和温度工艺参数对Cu-W复合镀层中微粒含量的影响，并对Cu—W电接触材料的电弧侵蚀性能进行了分析。结果表明：在最佳的复合电沉积工艺下，Cu—W的复合沉积量质量分数在17％-23％；Cu—W电接触材料在电流〈20A条件下，材料由阴极向阳极转移，电流〉20A条件下，材料的转移方向相反；电弧侵蚀后Cu—W电接触材料的表面呈现凸起、凹坑和气孔等形貌特征。

The Cu-W composite was deposited on the surface of pure copper by composite electrodeposition, to make sure it satisfy the service performance of contact material. The influence of W mass concentration in Cu-W composite deposits, current density, stirring intention and temperature on the W particulate content in Cu-W composite deposits was studied. The electrical erosion performances of Cu-W electrical contact materials was analyzed. The results indicate that under the optimal process, W particulate content in Cu-W composite deposits is between 17-23%. The anode gains mass when current value is less than 20A, and the anode losses mass when current value is more than 20A. The surface morphology of Cu-W is bulge, pit and pore.