微电子封装技术的发展现状

Present development status of microelectronic package technology

论述了微电子封装技术的发展历程、发展现状及发展趋势,主要介绍了微电子封装技术中的芯片级互联技术与微电子装联技术。芯片级互联技术包括引线键合技术、载带自动焊技术、倒装芯片技术。倒装芯片技术是目前半导体封装的主流技术。微电子装联技术包括波峰焊和再流焊。再流焊技术有可能取代波峰焊技术,成为板级电路组装焊接技术的主流。从微电子封装技术的发展历程可以看出,IC芯片与微电子封装技术是相互促进、协调发展、密不可分的,微电子封装技术将向小型化、高性能并满足环保要求的方向发展。

The development progress,present status and development trend of microelectronic package technology had been discussed that including IC chip jointing technology and microelectronic assembly technology.The technology of flip chip,wire bonding and tape automated bonding were introduced.At present,the technology of flip chip was mainstream technology.Meanwhile,wave soldering and reflow soldering were expounded.Reflow soldering possibly became mainstream of microelectronic assembly technology instead of wave soldering.By the development progress of microelectronic package,the close relation could be made out between IC chip and microelectronic package technology.The development trend of microelectronic package technology was small size,high property and the benefit for environmental protection.