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Deposition of crackless freestanding diamond films on Mo substrates with Zr interlayer 被引量:2

Deposition of crackless freestanding diamond films on Mo substrates with Zr interlayer
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摘要 The Mo substrate with Zr interlayer,namely composite substrate,was employed to solve the problem of crack formation in the freestanding diamond film deposition.Freestanding diamond films deposited on the composite substrates by the direct current arc plasma jet chemical vapor deposition(CVD) method were investigated with scanning electron microscopy(SEM),X-ray photoelectron spectroscopy (XPS),X-ray diffraction(XRD),and Raman spectroscopy.In addition,the stress distribution during the large area freestanding diamond film deposition on the composite substrate was analyzed based on the finite element model ANSYS.The results reveal that Zr interlayer can be easily destroyed during the post-deposition cooling process,which is helpful for stress release and crack avoiding in diamond films. The Mo substrate with Zr interlayer,namely composite substrate,was employed to solve the problem of crack formation in the freestanding diamond film deposition.Freestanding diamond films deposited on the composite substrates by the direct current arc plasma jet chemical vapor deposition(CVD) method were investigated with scanning electron microscopy(SEM),X-ray photoelectron spectroscopy (XPS),X-ray diffraction(XRD),and Raman spectroscopy.In addition,the stress distribution during the large area freestanding diamond film deposition on the composite substrate was analyzed based on the finite element model ANSYS.The results reveal that Zr interlayer can be easily destroyed during the post-deposition cooling process,which is helpful for stress release and crack avoiding in diamond films.
出处 《International Journal of Minerals,Metallurgy and Materials》 SCIE EI CAS CSCD 2010年第2期246-250,共5页 矿物冶金与材料学报(英文版)
基金 supported by the National Natural Science Foundation of China(No.50471090)
关键词 chemical vapor deposition diamond film INTERLAYER thermal stress finite element analysis chemical vapor deposition diamond film interlayer thermal stress finite element analysis
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