摘要
借助Pro/Engineer实现环模的三维建模,通过ANSYS对环模温度场进行数值模拟,揭示其温度场分布规律。对环模进行结构静力学、结构动力学、结构热耦合数值模拟,揭示环模的应力场分布规律。重点探讨了参数模孔长径比对环模应力的影响。模拟结果显示模孔长径比为5:1时应力最小,与相关资料报道吻合。
In virtue of Pro/Engineer, the loop die 3D model was created. The loop die temperature by ANSYS and reveals the distributing of temperature were simulated. We do simulation of the structural static, structural dynamic and structural thermal coupling analysis and finds the distribution of stress of the loop die. Focuses on the stress infection of the length-diameter ratio. The results shown that the stress is minimum as the ratip length-diameter 5: 1.
出处
《太阳能学报》
EI
CAS
CSCD
北大核心
2010年第1期132-136,共5页
Acta Energiae Solaris Sinica
基金
山东省资源节约型社会科技支撑体系建设专项计划(2006JY22)