化学镀法制备钯膜工艺

Process of preparation of palladium membrane by electroless plating

以多孔Al2O3陶瓷管为载体,采用化学镀法制备了钯膜。考察了化学镀温度及载体孔径对制备钯膜的影响,并利用扫描电镜对钯膜形貌结构进行了表征。研究表明,化学镀15min,钯沉积速率较快;反应时间延长至120min,钯沉积量增加,但是沉积速率降低。随着化学镀温度的升高,钯沉积量增加;但是温度过高,会导致钯利用率降低;温度为318K,化学镀钯膜较适宜。在孔径为0.2μm的Al2O3陶瓷管表面制备的钯膜平整、致密,其二次镀钯膜N2渗透速率为1.7×10-9mol/(m2·s·Pa)。

Pd membranes were prepared on porous Al2O3 ceramic tubes by electroless plating.The effects of temperature and pore size of substrate on the Pd membrane preparation were studied,and the microstructure and morphology of the Pd membrane were characterized by scanning electron microscopy （SEM）.The results indicated that the Pd deposition rate is faster when the electroless plating time is 15 min.However,when the reaction time extends to 120 min,the amount of Pd deposit is increased while the deposition rate is reduced.The amount of Pd deposits is increased with increasing temperature,but the utilization ratio of Pd is decreased at higher temperature.The optimal temperature is 318 K.A level and compact Pd membrane can be obtained on the porous Al2O3 ceramic tube with a pore size of 0.2 μm.The N2 permeation rate is 1.7 × 10^9 mol/（m^2·s·Pa） for a Pd membrane deposited twice.