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塑封器件中高聚物的失效分析 被引量:6

High Polymer Failure Analysis in Plastic Packaging Device
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摘要 文章分析了塑封器件中高聚物在封装固化过程中和使用过程中常见的损伤或失效,结果表明:封装固化过程中,当高聚物材料收缩受到周围材料的约束时,由于残余应力的存在,可引起气孔、孔隙、微裂纹,即形成了一系列微小缺陷;在后续的生产工艺以及产品使用过程中的热-机械载荷作用下,固化中产生的微小缺陷或损伤会扩展、汇合而形成宏观裂纹,导致气孔受潮、水汽膨胀,最终引起器件的失效。分析还表明:在保证基体强度的条件下,设计界面强度较高、粒径分散度较低、平均粒径较小的微粒填充高聚物复合材料有利于改善高聚物的性能,降低其失效机率。 In this paper,the damage and failure of the high polymer has been analyzed.During the packaging curing,some defect,such as microcrack,can be come into being because of the residual stress.During the production process and product service,these defect can be extent to macrocrack.When moisture in the device is absorbed,the device will be failure.To minimum the failure probability,polymer with smaller filling particle diameter should be used.
作者 郝秀云 杨洁
出处 《电子与封装》 2011年第5期10-12,共3页 Electronics & Packaging
关键词 塑封器件 失效分析 损伤机理 plastic packaging device failure analysis damage mechansim
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参考文献11

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