摘要
总结微电子封装技术对封装基片材料性能的要求,介绍Al2O3的多晶转变和典型性能,讨论超细Al2O3粉体的3种制备方法:固相法、气相法和液相法;分析Al2O3陶瓷常用烧结助剂的基本作用和Al2O3陶瓷常用的6种烧结方法:常压烧结法、热压烧结法、热等静压烧结法、微波加热烧结法、微波等离子烧结法和放电等离子烧结法;指出Al2O3陶瓷基片的发展方向。
The elemental requirements for electronic packaging substrate materials were summarized.The polymorphic transformation and typical properties of alumina were introduced.Three synthesis methods of alumina ultrafine powder were discussed,namely solid phase,gas phase and liquid phase methods.The effect of alumina ceramics sintering additives and six kinds of sintering technologies were analyzed,namely pressureless sintering,hot pressing sintering,high temperature isostatic pressing,microwave sintering,microwave plasma sintering and spark plasma sintering.The development trends of alumina ceramics substrate materials were pointed out.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2011年第8期1893-1903,共11页
The Chinese Journal of Nonferrous Metals
关键词
电子封装材料
AL2O3陶瓷
超细粉体
烧结助剂
烧结方法
electronic packaging materials
alumina ceramics
ultrafine powder
sintering additives
sintering technologies
