摘要
以沉积速度和镀层中磷含量为评价指标,通过实验分别考察了硫酸镍质量浓度、硫酸镍与次磷酸钠的摩尔比、pH、温度及EDTA-2Na对化学镀镍-磷合金的影响。实验结果表明,当硫酸镍质量浓度为20~30g/L、n(硫酸镍)∶n(次磷酸钠)为0.25~0.40、络合剂总质量浓度为35g/L(其中EDTA-2Na为2.5~10.0 g/L),θ为86~90℃、pH为4.6~5.0时,沉积速度为11.87~14.00μm/h,镀层中w(磷)为10.2%~12.0%;镀层X-射线衍射图谱显示出非晶态结构所具有的典型"馒头峰"。
The influence of nickel sulfate concentration,mol ratio between nickel sulfate and sodium hypophosphite,pH,temperature and EDTA-2Na content on deposition rate and phosphorus content in Ni-P alloy electroless plated coating were studied by experiments.Results showed that the deposition rate was 11.87~14.00 μm/h and phosphorus content in the coating was was 10.2%~12.0% under following parameters:sulfate concentration(20~30 g/L),mol ratio between nickel sulfate and sodium hypophosphite(0.25~0.40),total complexing agent 35 g/L,(EDTA-2Na 2.5~10.0 g/L in which),temperature(87~92 ℃),pH(4.6~5.2).The X-ray diffraction pattern of coating showed that a typical steamed bread peak,which meant the amorphous structure of the coating.
出处
《电镀与精饰》
CAS
北大核心
2012年第4期5-9,共5页
Plating & Finishing
关键词
化学镀镍
沉积速度
镀层磷质量分数
配位作用
electroless nickel plating
deposition rate
phosphorus content in the coating
Coordination role