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聚碳酸酯/石墨烯微片复合材料的制备及其导电性 被引量:8

Preparation and Electrical Conductivity of Polycarbonate/NGPs
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摘要 以3种不同形态碳纳米材料(石墨烯微片、炭黑、石墨烯微片母料)为导电填料,通过熔融法制备相应的聚碳酸酯复合材料。研究不同导电填料和加工工艺对复合材料导电性能的影响。研究结果表明:石墨烯微片,炭黑和石墨烯微片母料填充聚碳酸酯制备复合材料的导电渗滤阀值分别为9%、12%和3%;选择合适的工艺参数,可以有效避免石墨烯微片片状结构在熔体加工过程中被严重破坏,且能均匀分散于聚碳酸酯中而提高复合材料的导电性。 Polycarbonate/carbon composite were fabricated based on polycarbonate and three different carbon additives (NGPs,CB and NGPs masterbatch). The effect of processing parameters and tapes of conductive fillers were investigated. The results showed that conductive composite fabricated by NGPs, CB and NGPs masterbatch exhibited percolation threshold of approximately 9 % ,12 % and 3 % respectively. Appropriate processing parameters were utilized for fabrication of polymer/ NGPs composite,that could be able to avoid the structure of NGPs being destroyed but uniformly dispersed in polycarbonate, helping to improve electrical conductivity of the composite.
出处 《塑料》 CAS CSCD 北大核心 2012年第4期1-3,共3页 Plastics
基金 厦门市科技计划项目(3502Z20101018) 中央高校基本科研业务费资助项目(JB-JC1001)
关键词 石墨烯微片 母料 聚合物 导电 工艺 nano graphene plates masterbatch polymer electrical conductivity process
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