大功率白光LED封装结构和封装基板

Structure and Substrate for High Power White LED Package

随着LED在照明领域的不断发展,功率和亮度不断提高,尤其是大功率白光LED的出现,热问题成为制约LED进一步发展的关键问题。介绍了大功率白光LED引脚式封装、表面贴装式(SMT)、板上芯片直装式(COB)和系统封装式(SiP)封装结构和金属、金属基复合以及陶瓷封装材料。重点阐述了金属芯印刷电路板(MCPCB)、金属基复合材料板以及陶瓷基板(如厚膜陶瓷基板、薄膜陶瓷基板、低温共烧陶瓷基板)等应用于大功率白光LED的封装基板,对各个基板的特点和散热能力进行了分析和对比。最后对大功率白光LED封装结构和封装基板的发展趋势进行了展望。

With the development of light emitting diode （LED） in the lighting field, especially the appearance of high power white LED whose power and brightness become more and higher, thermal problems become the key factors of LED further development. The lamp LED, surface mounted technology （SMT）, chip on board （COB） and system in package （SIP） package structure, and metal, metal matrix composites and ceramics package materials used in high power white LED are introduced. At the same time, the metal core printed circuit board （MCPCB）, metal matrix composites plate and the ceramic substrate （such as thick film ceramic substrate, thin film ceramic substrate and low temperature co-fired ceramic substrate） used in high power white LED package substrate are reviewed. And the various characteristics and thermal conductivity of the substrate are analyzed and compared. Finally, the high power white LED package development trend of the structure and the package substrate is prospected.