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机载电子产品上复合材料轻量化设计与应用 被引量:3

Design and Application of Lightweight Composite in Airborne Electronic Components
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摘要 针对某机载电子产品的轻量化应用需求,开展了增强型聚苯硫醚材料制件的注塑成型和表面金属化镀覆工艺技术研究,并对研制完成的增强型聚苯硫醚隔筋制件进行了温度冲击试验验证,试验结果表明:试验件尺寸稳定性好,镀层耐高低温冲击环境适应性强,能够满足机载环境下的使用要求。 Aimed at light weight application requirement of airborne electronic components,injection molding and metallization processing of fiber reinforced poly(phenylene sulphide) were researched.The temperature shock test was carried out to baffle rib products injecting by fiber reinforced poly(phenylene sulphide).The test result shows that the products have good dimensional stability and the coating has good environment adaptability under high-low temperature.The products can meet the operating requirements of airborne environment.
出处 《电子工艺技术》 2013年第3期174-177,共4页 Electronics Process Technology
基金 装备预先研究项目(项目编号:51318070119)
关键词 机载电子产品 轻质复合材料 注塑 金属化 Airborne electronic components Lightweight composite Injection molding Metallization
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