静电纺丝法制备低渗流阈值聚酰亚胺/炭黑导电复合材料

PI /CB Conductive Composites with Low Percolation Threshold Prepared by Electrospinning Technique

原位聚合法得到聚酰胺酸(PAA)/炭黑(CB)聚合物溶液,通过静电纺丝、热亚胺化制备了聚酰亚胺(PI)/炭黑复合纳米纤维膜,经过热压加工工艺得到以炭黑为填料的聚酰亚胺基导电复合材料。扫描电镜(SEM)和透射电镜(TEM)观察了复合材料的微观形貌,通过LCR数字电桥、拉伸测试和热重分析(TGA)研究了复合材料的电学性能、力学性能与热稳定性。实验表明,PI/CB导电复合材料的渗流阈值为6%(质量分数);在渗流阈值时,材料的拉伸强度和断裂伸长率分别为93.9 MPa和68.9%,10%热失重温度为575.8℃。聚酰亚胺/炭黑导电复合材料表现出优异的力学性能和热稳定性能。

Carbon black （CB） as conductive fillers was added into polyimide matrix, the high performance conductive composite was fabricated. Polyamide acid （PAA）（the precursor of polyimide）/CB solution was firstly prepared by the in-situ polymerization method, then it was electrospun into nanofiber mat, at last, it was laminated into the thin plate by the hot-press process. Conductive properties, mechanical properties and thermostability of composites were characterized by LCR digital meter, tensile test and thermal gravimetric analysis （TGA）. The results show that the percolation threshold of PI/CB composites is low to 6 %. The tensile stress and 10 % mass loss temperature （T10%） are 93.9 MPa and 575.8℃ , respectively, at the percolation threshold. PI/CB composites represent excellent mechanical properties and thermal properties.