大规模集成电路导电薄膜的织构效应

Texture Effect of Interconnection Thin Films in Very Large-Scale Integrated Electronic Circuits

利用Ｘ射线技术检测了普通工艺和改进工艺制备的内联导电铝膜的织构．分析表明，高体积量且锋锐的｛１１１｝面织构可以大幅度降低大规模集成电路芯片的失效率．讨论了失效的原因及｛１１１｝织构的有利作用．指出了新一代内联导电铜膜相应织构问题的重要性．

The texture of interconnecting aluminum films prepared by conventional and modified technology was examined using X-ray diffraction It is demonstrated, that the high volume fraction and high sharpness of the { 111 } fiber texture will drastically reduce the invalidation ratio of very large-scale integrated electronic circuits. The reasons of invalidation and the positive effects of the {111 } fiber texture are discussed. It is pointed out, that attention should be paid to the corresponding texture problems in new interconnecting copper films.