摘要
介绍了一种镍钯金ENIPIG工艺,阐述了其工艺流程和优点。ENIPIG的钯层能有效防止金和镍相互迁移,高温后仍具有良好的键合和焊锡性能,能耐多次回流焊,且能做细小间距的板,适应于高密度HDI的要求。
This paper introduce the ENIPIG process and its advantages. Palladium layer is a diffusion barrier between gold and nickel. After high temperature aging, it still has excellent bonding performance and solderability, and can endure relfow several times. It is also suitable for high density interconnect board manufacture.
出处
《印制电路信息》
2014年第3期46-49,共4页
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