络合-陶瓷膜耦合技术处理低浓度含铜废水

TREATMENT OF WASTEWATER CONTAINING LOW CONCENTRATION OF Cu ION USING COMPLEXATION-CERAMIC MEMBRANE COUPLING PROCESS

采用孔径为200nm的陶瓷膜，以聚丙烯酸（PAA）为络合剂，含Cu^2＋废水为模拟废水，研究了络合．陶瓷膜耦合技术处理低浓度含铜废水过程。重点考察了运行时间、络合剂浓度、络合剂／金属离子质量浓度比（P／M）、溶液pH、离子强度、操作压力等对膜通量及Cu^2＋截留率的影响。结果表明，当P／M≥5、pH为5～6时，Cu^2＋的截留率接近100%，膜通量较高且趋于稳定；外加盐（NaCl和Na2SO4）导致Cu^2＋截留率下降，可以通过增加P／M值多级处理达到对Cu^2＋的理想去除。

Complexation-ceramic membrane is used to dispose waste water containing low concentration of Cu ion. The aperture of ceramic membrane is 200 nm, using P AA as the complexation and Cu^2＋ contained water as simulated wasted water. The influence of run time, capacity of complexation, mass ratio of complexing agent to metallic ion （PIM）, pH value of solution, intensity of ions, run pressure on membrane flux and retention of Cu^2＋ is investigated. The results show that when the P/M≥5 and pH at 5-6, the retention of Cu^2＋＂ approach 100%. The membrane flux is fairly high and stable. Adding salt （NaCI and Na,SO.） decreases the retention level of Cu^2＋. Yet by increasing the PIM value, the Cu＂ can be nearly fully retained.