摘要
以甲基三甲氧基硅烷和二甲基二甲氧基硅烷为单体,采用硅氧烷水解-缩合法制备了陶瓷电阻封装胶用有机硅树脂;利用红外光谱(FT-IR)法、热失重分析(TGA)法对其结构和热性能进行了分析。研究结果表明:当水解温度为50℃、n(甲基三甲氧基硅烷):n(二甲基二甲氧基硅烷)=1.7:1.0和n(单体)∶n(水)=1.00∶2.63时,有机硅树脂的综合性能相对最佳,并且其具有黏度小、干燥快和耐热性强等优点。
With methyl trimethoxy silane and dimethyl dimethoxy silane as monomers, a silicone resin for ceramic resistor encapsulation adhesive was prepared by hydrolysis-polyeondensation method from siloxane. Its structure and thermal properties were analysed by infrared spectroscopy (FT-IR) and thermogravimetie analysis (TGA) methods. The research results showed that the silicone resin had the relatively best combination property, and had some advantages such as smaller viscosity, faster drying speed and stronger heat resistance when hydrolysis temperature was 50 ℃, molar ratios of n (methyl trimethoxy silane) : n (dimethyl dimethoxy silane) and n (monomer) :n (water) were 1.7:1.0 and 1.00:2.63 respectively.
出处
《中国胶粘剂》
CAS
北大核心
2014年第6期21-24,共4页
China Adhesives
基金
中央高校基本科研业务费专项资金(2013ZM0072)
广东省绿色化学产品技术重点实验室开放基金(GC201201)
广东高校轻化工清洁生产工程技术研究中心开放课题基金资助
关键词
封装胶
有机硅树脂
硅氧烷
耐热性
醇溶性
陶瓷电阻
encapsulation adhesive
silicone resin
siloxane
heat resistance
alcohol-soluble
ceramic resistor