摘要
采用三维有限元法分析了面阵二极管激光器背冷式封装结构的散热效率 ,对次热沉厚度 ,冷却器结构参数进行了优化设计 ,计算结果表明 ,优化设计后的封装结构 ,可满足面功率密度为5 0 0 W/cm2 ,占空比为 2 0
A water cooler for 2D laser diode arrays cooling was presented. The cooler can be manufactured with line cutting method and with very low cost. The thermal resistance of the laser diode with back cooling packaged structure was calculated and the thickness of the submount and the structure of the cooler were optimized by three-dimension finite element method. The calculated results indicated that the thickness of submount, the cooling water channel depth and the fin width have optimum values. The lowest thermal impedance of the water cooler was 0.093°C· cm2/W. The package design can meet the needs of heat dissipating for high power laser diode arrays with power density of 500 W/cm2 and 20% duty cycle.
出处
《强激光与粒子束》
EI
CAS
CSCD
北大核心
2001年第5期537-540,共4页
High Power Laser and Particle Beams
基金
国防科技基础研究基金资助课题 (0 0 3 0 2 )