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高平均功率面阵二极管激光器散热分析 被引量:7

Thermal analysis of high average power laser diode arrays
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摘要 采用三维有限元法分析了面阵二极管激光器背冷式封装结构的散热效率 ,对次热沉厚度 ,冷却器结构参数进行了优化设计 ,计算结果表明 ,优化设计后的封装结构 ,可满足面功率密度为5 0 0 W/cm2 ,占空比为 2 0 A water cooler for 2D laser diode arrays cooling was presented. The cooler can be manufactured with line cutting method and with very low cost. The thermal resistance of the laser diode with back cooling packaged structure was calculated and the thickness of the submount and the structure of the cooler were optimized by three-dimension finite element method. The calculated results indicated that the thickness of submount, the cooling water channel depth and the fin width have optimum values. The lowest thermal impedance of the water cooler was 0.093°C&middot cm2/W. The package design can meet the needs of heat dissipating for high power laser diode arrays with power density of 500 W/cm2 and 20% duty cycle.
出处 《强激光与粒子束》 EI CAS CSCD 北大核心 2001年第5期537-540,共4页 High Power Laser and Particle Beams
基金 国防科技基础研究基金资助课题 (0 0 3 0 2 )
关键词 二级管激光器 冷却器 热沉厚度 三维有限元法 高平均功率面阵 散热 优化设计 Finite element method Heat transfer Semiconductor lasers Water cooling systems
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