导热高分子材料研究进展

Advances in thermal conductive polymeric materials

讨论了提高聚合物导热性能的途径———合成高导热系数的结构聚合物 ,用高导热无机填料对聚合物进行填充复合。综述了导热高分子材料的研究成果 :聚合物导热的基本概念和影响其导热性能的因素及导热系数的预测理论 ;聚合物基导热复合材料的选材、复合技术及其应用。指出了导热高分子材料的研究方向———纳米导热填料的研究和开发 ;聚合物树脂基体的物理化学改性 ;聚合物基体与导热填料复合新技术的研究和开发 ;复合材料导热模型的建立、导热机理 (特别是聚合物基体与导热填料界面的结构与性能对材料导热性能的影响 )及导热通路的形成等 ;探索高导热本体聚合物材料的制备方法和途径等。

Thermal conductive polymeric materials are superior to metals in electronic engineering, cooling systems and heat transfers. Approaches to improve the thermal conductive properties of polymer are to synthesizer high heat conductive polymers and composite polymer with high thermal conductive filler. The results of study on thermal conductive properties of polymer and their composites were reviewed with 39 references, including the concepts of heat conducting, the effecting factors of thermal conductivity of polymer materials, etc. The resent advances in heat conductive polymeric composites and the high conducting fillers were described. The researching directions of thermal conductive polymeric materials are studies and developments of nanometer fillers with high heat conductivity, modifying polymer resin by physical chemistry methods, the technologies of compounding polymer with high conductive fillers, the researches of heat conductive mechanism and model and searching the methods and processing of high heat conductive polymer structured materials. These have important significances to develop thermal conductive polymeric materials.