摘要
简要介绍了利用硅的各向异性腐蚀工艺研制的非整体膜结构的敏感硅芯片 ,较详细地报告了用此硅芯片封装成的加速度敏感元件 。
The silicon chip of dual-E non-integral structure film which is prepared by the technique of anisotropic wet etching of silicon has been introduced.By the use of the silicon chip accelerometer elements have packaged.The excellent properties of this kind accelerometer are reported.
出处
《仪表技术与传感器》
CSCD
北大核心
2002年第5期50-51,共2页
Instrument Technique and Sensor