期刊文献+

离子束增强沉积技术 被引量:5

Ion Beam Enhanced Deposit Technology
下载PDF
导出
摘要 采用离子束增强沉积 (IBED)铜过渡层和电子束蒸镀铜膜结合制备的单质膜结构 ,比采用电子束蒸镀钛 铜多层膜结构工艺简单 ,且不增加光刻腐蚀工艺难度 ,铜膜沉积于低表面粗糙度 (Ry≤ 0 .1μm )的氧化铝陶瓷基片表面获得了良好的膜 基附着力。实验证明 It is less complicated to make a simple material structure by the combination of IBED transition layer and EBD copper film than to make a multi layer Ti Cu film by EBD.Moreover, the combination of IBED and EBD wouldn't make the next process of photo etching more difficult than EBD. Favorable adhesion can be realized by depositing copper film on the alumina ceramics that has low surface roughness( Ry ≤0.1 μm). Experiments show that the method using the IBED transition copper layer combined with EBD copper film is the best technology among the film fabrication technologies popularly used at present.
出处 《原子能科学技术》 EI CAS CSCD 2002年第4期458-461,共4页 Atomic Energy Science and Technology
  • 引文网络
  • 相关文献

参考文献4

二级参考文献2

  • 1R. Carpenter,D. S. Campbell. Stress in the components of a thin film silicon monoxide capacitor and its relationship to dielectric loss[J] 1969,Journal of Materials Science(6):526~531
  • 2R. Carpenter,D. S. Campbell. Stress in alkali halide films[J] 1967,Journal of Materials Science(2):173~183

共引文献4

同被引文献40

引证文献5

二级引证文献11

;
使用帮助 返回顶部