基于环形振荡器的绑定前硅通孔测试

Ring Oscillator-Based Prebond TSV Test

硅通孔(TSV)的电阻开路故障和泄漏故障会降低三维集成电路的良率和可靠性,为在制造流中尽早排除故障TSV,提出一种基于环形振荡器的绑定前TSV测试方法.首先将环形振荡器的TSV接收器分为一般反相器和施密特触发器,并比较这2种环形振荡器的测试分辨率;然后把施密特触发器作为TSV接收器引入绑定前TSV测试;为防止误测或误诊断,采用多个低电压测试TSV.基于45 nm PTM CMOS工艺的HSPICE模拟结果表明,与现有同类方法相比,该方法具有更高的测试分辨率,且能测试大电容TSV和同时存在电阻开路故障和泄漏故障的TSV.

Resistive open fault and leakage fault in TSV decrease the yield and reliability of 3D-ICs. To screen out these faults early in the manufacturing flow, a prebond TSV test method using ring oscillator is proposed. Firstly, according to different TSV receivers which can be normal inverter or Schmitt-Trigger in-verter, we divide the ring oscillators into two types and compare their test resolution. Then, the Schmitt-Trigger inverter is used as TSV receiver in our test structure. In order to avoid the wrong test or di-agnosis, TSV is tested in multiple low voltage levels. Experimental results with HSPICE simulations using 45nm CMOS technology show that the proposed test scheme achieved a higher resolution compared to pre-vious works. In addition, the test scheme can be used to test large capacitance TSV and the TSV which exists resistance open fault and leakage fault.