冷板传热特性的计算流体力学仿真方法

CFD Simulation Method of Heat Transfer Characteristics of Cooling Plate

针对大功率电子模块用冷板在不同工况条件下的温升是否是线性关系和热效率如何变化等问题,提出冷板在不同工况下的传热特性的计算流体力学仿真方法。通过对电子模块元器件组成和传热过程进行简化,以及对流体的属性参数设为常数等假设简化传热模型。设置散热元器件为等热流密度边界等边界条件,选择SIMPLE算法作为控制方程的求解算法,仿真得到冷板在不同工况下传热特性。实验结果表明:基于计算流体力学方法的仿真模型对冷板在不同工况下的传热特性的模拟比较准确。

Heat transfer characteristics such as linearity of temperature raise and thermal efficiency under various working conditions of power electronics module cooling plate have not been solved. To solve this problem,CFD simulation method of heat transfer characteristics of cooling plate under various working conditions were proposed. By simplifying electronic module component composition and heat transfer process,setting fluid property parameter as constant,we assumed simplify heat transfer model. Choosing SIMPLE arithmetic to solve arithmetic of control equation,the heat transfer characteristics of cooling plate under various working conditions were generated. The results show that relate heat transfer verification tests show accuracy of heat transfer characteristics simulation result of simulation model based on CFD simulation method for cooling plate under various working conditions.