保温时间对TLP扩散焊焊接TA2纯钛接头组织和性能的影响

Effects of Holding Time on Microstructure and Properties of TLP Diffusion Bonded TA2 Pure Titanium Joint

以Cu-Ni-Sn-P非晶合金作为中间层材料,采用瞬时液相(TLP)扩散焊焊接了TA2工业纯钛,研究了保温时间对接头组织和性能的影响。结果表明:该接头结合处由残留中间层、等温凝固层和界面扩散层组成,随着保温时间的延长,残留中间层厚度减小,界面扩散层宽度增大,当保温5min后,接头处基本由羽毛状界面扩散区组成,宽度为25μm;接头剪切强度随保温时间的延长先增后降,保温时间为3min时达到最大,约180MPa,剪切断裂方式为脆性+塑性混合型断裂。

With Cu-Ni-Sn-P amorphous alloy as interlayer material, TA2 pure titanium was welded using transient liquid phase （TLP） diffusion bonding and the effects of holding time on the microstructures and mechanical properties of the joint were studied. The results show that the joint seam consisted of a residual layer, an isothermal solidification layer and an interracial diffusion layer. With the increase of holding time, the residual layer thickness decreased and the diffusion layer was broadened. After holding for 5 min, the joint mainly consisted of feather-like diffusion layer with the width of 25μm. The shear strength of the joint first increased and then decreased with the holding time increase and reached the largest value of 180 MPa at the holding time of 3 min. The shear fracture mode was a mixed ductile and brittle fracture.